| Class Name：Bergquist |
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Bergquist ＇s Thermal Products Group is a world leading developer and manufacturer of thermal management materials which provide product solutions to control and manage heat in electronic assemblies and printed circuit boards. Sil-Pad products are used by many of the world＇s largest OEMs in various industries including automotive, computer, power supply, military and motor control. |
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| Class Name：Laird |
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Laird Technologies produces some of the world’s highest-rated thermally conductive materials for use in electronic packaging. Laird thermal management products include gap fillers (including putties), phase change materials, thermal greases, thermally conductive circuit boards and thermally conductive insulator materials.
In April 2004, Laird Technologies added Thermagon’s thermal interface products to Laird product portfolio in order to grow and maintain Laird leadership position in high performance thermal interface materials and technology. |
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| Class Name：Diemat |
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Diemat＇s thermal adhesives are a family of Ag loaded organic adhesives with unmatched thermal conductivities up to 60W/mK, exceeding most common solders. Plating, flux, and atmosphere requirements of solder attach are eliminated when used to replace solder. Lower processing temperatures also allow the use of lower cost plastic packages. The DM4030, DM5030, and DM6030 series range in polymer chemistry from thermoplastic to thermoset with interpenetrating networks of both polymers, offering application-specific solutions to a variety of thermal and stress management problems. |
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| Class Name：Timtronics |
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TIMTRONICS is a leading manufacturer of the most advanced Non-Silicone and Silicone Heat Sink Compounds with distribution worldwide. Unique formulations include High Temperature and Electrically Conductive Compounds. TIMTRONICS also custom formulates for specific design applications. |
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| Class Name：Geltec αGEL |
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Geltec αGEL , while preserving its inherent softness and tackiness, turns into more multi-functional material with some compatible fillers. One such application is the invention of, unique, versatile, high performance thermal conductivity materials ( sheet-type and past-type ). RE-10, with electromagnetic absorption characteristics on top of thermal conductivity, is also a variation in the material.
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| Class Name：Graftech eGRAF® |
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Graftech Inc. manufactures eGraf™ products as unique solutions to the problem of heat buildup in high-powered electronic devices , The eGraf electronic thermal management product family includes interface materials and thermal management components. |
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| Class Name：Dow Corning |
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| Class Name：LEDtherm |
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Bergquist 
